Vacuum processing system for producing components

ABSTRACT

The present invention provides a vacuum processing system for creating processed substrates having a domed lid on at least the transfer chamber. The lid may be provided either convex to the chamber, thus decreasing the volume of the chamber and the amount of microparticulate matter present in the chamber, or concave to the chamber. The invention also provides features to enhance the use of the domed lid, e.g., structural features that decrease lifting of the edges of the lid upon introduction of a vacuum to the chamber.

FIELD OF THE INVENTION

This invention generally relates to vacuum processing systems.Specifically, this invention relates to methods and apparatuses formanufacturing components using a vacuum processing system having animproved transfer chamber.

BACKGROUND OF THE INVENTION

A number of benefits can be obtained by manufacturing certain functionalcomponents within a vacuum environment. In view of these advantages,vacuum processing systems for the processing of various substrates havebeen developed. Typically, a vacuum processing system has a centralizedtransfer chamber mounted on a monolith platform. The transfer chamber isthe center of activity for the movement of the substrate being processedin the system. Substrates are generally in the transfer chamber onlylong enough to be transferred to another chamber for storing orprocessing. One or more process chambers attach to the transfer chamberat valves through which substrates are passed by a robot in the transferchamber. The valves close in order to isolate the process chambers whilesubstrates are being processed therein.

Physically, the process chambers are either supported by the transferchamber and its platform or are supported on their own platform. Insidethe system, the transfer chamber is typically held at a constant vacuum,whereas, the process chambers may be pumped to a greater vacuum forperforming their respective processes. Following processing, thepressure of the process chamber must be returned to the level in thetransfer chamber before opening the valve to permit access between thechambers.

Access to the transfer chamber for substrates from the exterior of thesystem, or from the manufacturing facility, is typically through one ormore load lock chambers. The load lock chambers cycle between thepressure level of the ambient environment and the pressure level in thetransfer chamber in order for the substrates to be passed, so the loadlock chambers transition the substrates between the atmospheric pressureof a very clean environment to the vacuum of the transfer chamber.

Some common transfer chambers have facets for four to six processchambers and load lock chambers. For a six-faceted transfer chamber,typically two of the facets are for load lock chambers, and the otherfour facets are for process chambers. The process chambers include rapidthermal processing (RTP) chambers, physical vapor deposition (PVD)chambers, chemical vapor deposition (CVD) chambers, etch chambers, etc.The productivity of a vacuum processing system is increased when moreprocess chambers are mounted to the transfer chamber, because moresubstrates can be processed at a given time. Additionally, less space isrequired in the manufacturing facility if the productivity of the systemis maximized. Thus, there is a need for larger transfer chamber to allowthe mounting of a greater number of process chambers.

In addition, certain substrates to be processed are very large, and thusrequire a large transfer chamber to allow processing of the substrate.For example, glass plates of certain flat-panel plasma displays areprocessed using thin-film techniques to deposit horizontal electrodesand vertical column electrodes onto the glass. Since it is desirable toprocess very large plates of glass for this purpose, a very largetransfer chamber is necessary to manipulate the glass substrate fortransfer to a processing unit.

It is desirable to keep the volume of the larger transfer chamber to aminimum in order to decrease manufacturing costs, increase efficiency ofthe chamber, and to reduce the effects of contamination due tomicroparticulate matter within the chamber. There is thus a need in theart for a vacuum processing system with improved capacity and efficiencyfor high throughput production of processed substrates.

SUMMARY OF THE INVENTION

The present invention features a vacuum processing system having a domedlid on at least the transfer chamber of the system. This domed lid canbe used with any vacuum processing system that utilizes a circular lidto form an airtight seal between the edge of the lid and thecorresponding edge of the chamber. Moreover, a single domed lid can bedesigned for attachment in either a convex or a concave configuration,allowing the user to change configuration if desired for differentprocessing protocols.

The lid of the invention is more cost effective and can be of greaterdiameter than conventional transfer chamber lids due to the decreasedweight of the domed lid compared to conventional, flat lids. These lidsmay be in any desired size range, and preferably are in a size range upto about 100 inches in diameter. The domed lid can be constructed usingany number of methods known in the art such as hydroforming,electroplating, and the like. In a preferred embodiment, the lid isproduced through spinning a metal, and in particular spinning stainlesssteel.

In a preferred embodiment, the lid is comprised of one or more windowsor access features to allow a user or a diagnostic device to view thesubstrate in the chamber during the manufacturing process, e.g., tomonitor positioning of the substrate prior to entrance into a processingchamber. A window for visualization of the substrate may be a sidewindow, i.e. a window that runs circumferentially at the edge of thetransfer chamber lid, or a window in the dome portion of the lid.

It is thus a feature of the invention that the domed transfer chamberlid may be provided with windows or other means for visualization of thesubstrate.

A single manufactured lid can be provided either convex or concave tothe chamber, thus providing flexibility to the user to alter theconfiguration of the lid. This is enabled in part by a structuralfeature that functions to prevent lifting of the lid from the o-ring atthe lid attachment site upon introduction of the vacuum to the transferchamber. In one exemplary embodiment, the structural feature involvesthe placement of the o-ring relative to the domed lid, i.e. an o-ringfurther from the edge to better prevent the lifting of the edge of thetransfer chamber lid. In a preferred embodiment, a structural feature inthe lid itself that absorbs distortion, such as an “S” transition asdescribed herein, is added to the structure of the chamber lid toprevent lifting during use. This allows the user to change configurationof the lid depending on the needs of the vacuum processing chamber fordifferent purposes. This flexibility of placement of the domed lidapplies to lids with or without a side window.

It is thus another feature of the invention that the domed transferchamber lid may be attached in either the convex or the concaveconfiguration.

It is an advantage of the present invention that the domed lid can bemanufactured using a number of techniques including but not limited tospinning, hydroforming, electroplating, and the like.

It is yet a further advantage of the invention that a single domed lidmay be used in either configuration.

It is a further advantage of the invention that the configurations ofthe domed transfer chamber lid convex to the chamber can decrease thevolume of the transfer chamber. Decreased volume can decrease themanufacturing costs as well as decreasing microcontamination.

It is yet a further advantage of the invention that the domed transferchamber may be greater in diameter than conventional transfer chamberlids, thus providing the capability of processing larger substratesand/or more substrates simultaneously.

It is yet another advantage of the invention that a structural featurethat absorbs distortion may be added to prevent lifting of the lid dueto vacuum pressure.

These and other objects, advantages, and features of the invention willbecome apparent to those persons skilled in the art upon reading thedetails of the vacuum processing system as more fully described below.

BRIEF DESCRIPTION OF THE DRAWINGS

The described features, advantages and objects of the present inventionare attained and can be understood in detail are illustrated by theembodiments illustrated in the appended drawings. It is to be noted,however, that the appended drawings illustrate only typical embodimentsof this invention and are therefore not to be considered limiting of itsscope, for the invention is intended to encompass other equallyeffective embodiments.

FIG. 1 is a top view of a schematic of an exemplary vacuum processingsystem incorporating the present invention.

FIG. 2 is a side view of one embodiment of the domed transfer chamberlid having an attachment convex to the vacuum and a window.

FIG. 3 is a side view of another embodiment of the domed transferchamber lid having an attachment convex to the vacuum with no window.

FIG. 4 is a side view of another embodiment of the domed transferchamber lid having an attachment concave to the vacuum and a window.

FIG. 5 is a side view of another embodiment of the domed transferchamber lid having an attachment concave to the vacuum with no window.

FIG. 6 is a closer view of an “S” transition of a preferred embodimentof the domed transfer chamber lid of the invention.

FIG. 7 is a side view of a domed transfer chamber lid having twosubstrate center finders.

FIG. 8 is a bottom view of a domed transfer chamber lid having twosubstrate center finders.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Before the present embodiments are described, it is to be understoodthat this invention is not limited to particular materials, substrates,etc. described, as such may, of course, vary. It is also to beunderstood that the terminology used herein is for the purpose ofdescribing particular embodiments only, and is not intended to belimiting, since the scope of the present invention will be limited onlyby the appended claims.

Where a range of values is provided, it is understood that eachintervening value, to the tenth of the unit of the lower limit unlessthe context clearly dictates otherwise, between the upper and lowerlimits of that range is also specifically disclosed. Each smaller rangebetween any stated value or intervening value in a stated range and anyother stated or intervening value in that stated range is encompassedwithin the invention. The upper and lower limits of these smaller rangesmay independently be included or excluded in the range, and each rangewhere either, neither or both limits are included in the smaller rangesis also encompassed within the invention, subject to any specificallyexcluded limit in the stated range. Where the stated range includes oneor both of the limits, ranges excluding either or both of those includedlimits are also included in the invention.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this invention belongs. Although any methods andmaterials similar or equivalent to those described herein can be used inthe practice or testing of the present invention, the preferred methodsand materials are now described. All publications mentioned herein areincorporated herein by reference to disclose and describe the methodsand/or materials in connection with which the publications are cited.

It must be noted that as used herein and in the appended claims, thesingular forms “a”, “an”, and “the” include plural referents unless thecontext clearly dictate otherwise. Thus, for example, reference to “asubstrate” includes a plurality of such substrates and reference to “themetal” includes reference to one or more metals and equivalents thereofknown to those skilled in the art, and so forth.

The publications discussed herein are provided solely for theirdisclosure prior to the filing date of the present application. Nothingherein is to be construed as an admission that the present invention isnot entitled to antedate such publication by virtue of prior invention.Further, the dates of publication provided may be different from theactual publication dates which may need to be independently confirmed.

Although the invention as described herein focuses on use of a domed lidfor a transfer chamber, it will be apparent to one skilled in the artupon reading the present disclosure that the same principles may applyto the lid of other components of a vacuum processing system, e.g., aprocess chamber or a load lock chamber. It is thus to be understood thatthe present invention is intended to encompass the use of such a domedlid in components of the vacuum system other than the transfer chamber.

Definitions

The term “substrate” as used herein refers to any material that is to beprocessed in the process chambers of the vacuum processing system. Suchsubstrates include, but are not limited to, silicon; glass, such asaluminosilicate glass, barium aluminosilicate glass, etc.; ceramics; andmetals, such as copper, aluminum and silver.

The terms “convex”, “convex attachment” and the like as used hereinrefer to a placement of the domed transfer chamber lid in which thecenter of the domed lid is closer to the floor of the transfer chamberthan the surrounding edge.

The terms “concave”, “concave attachment” and the like as used hereinrefer to a placement of the domed transfer chamber lid in which thecenter of the domed lid is further from the floor of the transferchamber than the surrounding edge of the lid.

The term “structural feature” as used herein refers to any alterationmade to the basic domed structure of the transfer chamber lid, eitherduring or after production, that will allow the lid to adjust to forcesduring use of the transfer chamber, i.e. forces exerted on the lid fromthe vacuum within the transfer chamber. Such a structural feature may bea structural variation introduced into the domed lid, e.g. an “S” shapedtransition near the attachment site of the lid. Other structuralvariations that may be used will be apparent to one skilled in the artupon reading the present disclosure.

The phrase “within the domed portion” as used herein refers to theplacement of any feature of the lid, for example a window, diagnosticdevice, or a processing device, where the feature is integrated withinthe rounded portion of the transfer chamber lid physically above thetransfer chamber.

Structural Aspects of the Invention

An electro-polished stainless steel spun dome is disclosed which servesas a cover for a chamber in which components (e.g. silicon wafers orglass surfaces) are transferred and/or processed under vacuumconditions. The dome can be attached to the chamber in at least twodifferent configurations, each of which allows access to the chamber byrobotics which carry out the manufacturing. In a first configuration,the,dome includes a window and is attached to the container in a convexmanner, i.e. with the curve of the dome protruding toward the chamber.The dome may also be connected in a convex manner without a window,which eliminates visibility of the substrate in the chamber but whichfurther reduces the volume of the chamber. In a second configuration,the curve of the dome is connected in a concave manner, i.e. with thecurve protruding away from the container. The convex position inparticular allows for a decrease in, the volume of the chamber and theamount of microparticulate matter present in the chamber.

FIG. 1 illustrates a schematic top view of an exemplary vacuumprocessing system 100 incorporating the present invention. This system100 is of the cluster type of systems that are typically used formanufacturing processed substrates in a vacuum such as integratedcircuits on wafers. The vacuum processing system 100 includes a transferchamber 102 typically mounted on a platform (not shown). The transferchamber 102 has a lid 103 mounted on its top. When it is attached, thelid 103 forms an airtight seal with the transfer chamber 102, so thatwhen the pressure in the transfer chamber is reduced to a vacuum, airdoes not leak into the transfer chamber 102. The transfer chamber 102has process chambers 104 attached at facets 106. Process chambers 104may be any type of process chamber, such as a physical vapor depositionchamber, a chemical vapor deposition chamber, an etch chamber, etc. Itis not uncommon for a manufacturer of process chambers to provide overtwenty different types of process chambers. The process chambers 104 maybe supported by the transfer chamber 102 or may be supported on theirown platforms depending on the configuration of the individual processchambers 104. Slit valves (not shown) in the facets 106 provide accessand isolation between the transfer chamber 102 and the process chambers104. Correspondingly, the process chambers 104 have openings (not shown)on their surfaces that align with the slit valves. The transfer chamber102 also has load lock chambers 108 mounted at facets 12. Openings (notshown) in the facets 112 provide access and isolation between the loadlock chambers 108 and the transfer chamber 102. Correspondingly, theload lock chambers 108 have openings on their surfaces that align withthe openings in facets 112.

The load lock chambers 108 are attached to a mini-environment 114. Theload lock chambers 108 and the mini-environment 114 have correspondingopenings (not shown) providing access between load lock chambers and themini-environment, while doors (not shown) for the openings provideisolation. The mini-environment 114 has pod loaders 116 attached on itsfront side. Openings (not shown) with corresponding doors (not shown)provide access and isolation between the mini-environment 114 and thepod loaders 116.

In operation, the substrates to be processed in the system 100 areplaced on the top of the pod loaders 116. Then a robot (not shown)begins removing the substrates, one at a time, out of the pod loadersand into one of the load lock chambers 108. After the substrates havebeen loaded into the load lock chamber 108, the pressure is the loadlock chamber is reduced to match that in the transfer chamber 102. Thenthe door on the transfer chamber side is opened, and the transferchamber robot (not shown) can begin servicing the load lock chamber 108.The transfer chamber robot moves the substrates from the load lockchamber 108 to one of the process chambers 104 for processing, andafterwards moves the substrates back to one of the load lock chambers108. When the load lock chamber 108 has received all of the processedsubstrates, the pressure in the load lock chamber is returned to that ofthe mini-environment, so the robot within the mini-environment can movethe processed substrates back to a substrate pod 116.

The domed lid of the invention can be used in place of most conventionalcircular chamber lids, providing equivalent functionality whiledecreasing the volume and/or cost of production of the transfer chamber.For ease of description, the different configurations of the transferchamber lid on the vacuum processing system are illustrated herein onlywith respect to the transfer chamber, not the entire vacuum processingsystem. One skilled in the art will be able to adapt the conceptsillustrated with the transfer chamber for use in any number of vacuumprocessing systems, as will be apparent upon reading the presentdisclosure.

FIGS. 2 and 3 illustrates side views of the domed lid 103 of theinvention having a convex attachment to the transfer chamber 118. Thedomed lid 103 is placed on the transfer chamber 118 in a manner thatallows access to the vacuum robot and effector blade 120 as well as tothe slit valve through a door opening 122, but reduces the volume of thetransfer chamber 118 as compared with conventional flat transfer chamberlids. This increases the efficiency of the vacuum processing system andreduces the possibility of contamination of the substrate by reducingexposure to microparticulate contamination. The volume of the transferchamber 118 added by the transfer chamber lid 103 is decreased by 50%relative to the volume added by a conventional, flat lid of the samediameter.

FIG. 2 illustrates an embodiment of the invention whereby the transferchamber lid is convexly attached domed transfer chamber lid, the lidhaving a side window 124 around the circumference of the lid to allow auser to view the substrate within the transfer chamber. Although the lid103 is convex to the transfer chamber 118, and thus will be lower in thecenter than at the attachment site 126, the diagonal line of sight ofthe user should still allow full view of the substrate, particularlysince the window 124 is circumferential to the substrate. Thus, thisplacement of the domed lid 103 provides the same level of visual accessas the conventional flat plate transfer cover with a side window 124.

FIG. 3 is a side view of a domed transfer chamber lid 103 having aplacement convex to the vacuum with no window. This embodiment resultsin a decreased volume compared with that illustrated in FIG. 2, and thusmay be preferable for certain uses, such as the processing of very largesubstrates.

FIGS. 4 and 5 show a side view of a domed transfer chamber lid 103having an attachment concave to the transfer chamber 118, with andwithout a window 124, respectively. This embodiment does not inherentlydecrease the volume of the transfer chamber 118, as the convexattachment does, but it allows for more space within the top of thetransfer chamber 118. Thus, if it is desirable to attach a diagnostic orprocessing mechanism internally at the center of the transfer chamberlid 118, this placement would allow for extra space at the centerwithout requiring extra space at the sides as would a conventional, flattransfer chamber lid. Thus, this embodiment would allow for more roominternally at the center of the chamber without requiring extension ofthe height to the side attachment site of the lid.

The domed lid of the invention is preferably provided on the transferchamber in a manner that minimizes the movement of the transfer chamberlid in response to the stresses of use, e.g., the tendency of the flangeto lift off the o-ring (not shown) when a plate is loaded. The featurethat reduces the response to stress can be a structural feature that ispart of the lid itself, a modification of the placement of the lid(e.g., placement of the o-ring seal of the attachment site 126 closer tothe chamber) or a combination thereof. In a preferred embodiment, thedomed lid of the invention is constructed to possess a structuralfeature 128 in the dome itself with the ability to absorb the additionalstress to the domed lid during use of the vacuum processing system, andmore preferably the structural feature is a small variation in thestructure near the edge of the lid, e g., an “S” transition between theflat o-ring sealing surface and the domed lid. Other structuralvariations that provide for sacrificial compliance for the purpose ofpreventing unwanted distortion can also be used, as will be apparent toone skilled in the art upon reading the present disclosure. Thisstructural feature allows a single domed lid to be attached to thetransfer chamber in either a convex or a concave placement withoutinterference of the stresses of use of the chamber.

FIG. 6 is a close-up view of an “S” transition of a preferred embodimentof the domed transfer chamber lid of the invention. The domed lid isshown in its convex attachment placement, but the structural featuressuch as the “S” transition are useful in either the convex or concavepositions, maintaining the feature of using a single lid for bothplacement positions.

As well as optionally having a transfer chamber window 124 around thesides, the transfer chamber lid 103 may also contain one or more windowsin the domed portion of the domed lid 103 to allow a user, diagnosticdevice and/or a manufacturing aid visual access to the substrate. Forexample, a substrate centering device 130 may visually access thesubstrate via one or more windows within the top of the domed lid.Preferably, the windows are provided in a symmetrical manner, i.e.evenly of the different sides of the lid, to preserve the integrity ofthe structure and to prevent stress due to variations in structureand/or weight.

A number of diagnostic, processing, and/or manufacturing devices may beattached to or integrated into the transfer chamber lid of theinvention. For example, substrate cooling systems may be attached on theinside of a domed transfer chamber lid to allow the substrate to becooled following processing. See e.g., U.S. Pat. No. 6,000,227 which isincorporated herein by reference. In such a configuration, the transferchamber's robot can move a substrate out of a process chamber 104,through the slit valve door 122 and into position for cooling in thetransfer chamber. In another example, a fixed sensor may be placedinternally on the transfer chamber lid to determine the substrateposition on the substrate support and to make appropriate corrections tothe position of the substrate for loading into the process chambers.

FIG. 7 is a side view, and FIG. 8 a bottom view, of a domed transferchamber lid 103 having two substrate center finders 130 integrated intothe domed portion of the lid. The center finders are used as exemplarymechanisms that could be attached to or into the transfer chamber lid,as would be apparent to one in the art upon reading the instantdisclosure. FIG. 7 shows the addition of a substrate center finder 130disposed in the transfer chamber lid 103. The transfer chamber lid 103is shown with four substrate center finders 130, which are used todetermine substrate position within the system.

The windows and/or diagnostic or manufacturing devices may be placed oneither the inside of the transfer chamber lid 103, or into the liditself, as with the illustrated transfer chamber lid of FIG. 7.

Preferably, the diagnostic, processing and/or manufacturing devices arcevenly distributed on or through the lid 103 of the invention to betterpreserve the integrity of the transfer chamber lid 103 and to preventstress to a particular area of the dome. For example, it is preferableto position the substrate center finders 130 symmetrically as viewedfrom above the lid, as illustrated in FIG. 8.

Manufacturing of the Domed Lid of the Invention

The domed transfer chamber lid of the invention may be manufactured byany number of different techniques known in the art, including butlimited to hydroforming, electroplating, spinning, and combinationsthereof. In a preferred embodiment, the transfer chamber lid is producedby spinning a metal, such as copper, steel, a metal clad with anothermetal, etc. Preferably, the lid is produced by spinning stainless steelinto a domed configuration.

Other methods and materials can be used to manufacture the domed lids ofthe invention depending on the desired features of the particular domedlid. For instance, where strength and weight are critical, a light andstrong material such as kevlar can be incorporated into the domed lid toprovide extra strength without sacrificing the reduced weight of thelid. Similarly, the material used to construct the dome may beintegrated with a material with properties that enhance heat resistance.

The structural features of the dome may be introduced duringmanufacturing, e.g., an “S” could be introduced by metal spinning duringthe fabrication of the spun domed lid. Structural features such as the“S” transition can also be introduced by methods such as roll formingeither before of after the dome spinning.

The domed lid of the invention is less expensive to manufacture thanconventional flat transfer chamber lids. The domed lid of the inventionwill also scale better to a larger size than the conventional flat platelids, due to the decreased weight of the domed lids and in particularthe spun domed lids. Thus, as the domed lids of the present inventionwill weigh less than a corresponding conventional flat plate lid of thesame diameter, they are especially useful for large transfer chambers.

The structural features of the dome may be introduced duringmanufacturing, e.g., an “S” could be introduced by metal spinning duringthe fabrication of the spun domed lid. Structural features such as the“S” transition can also be introduced by methods such as roll formingeither before or after the dome spinning.

Electroplating may also be used to substantially fabricate and/or tofinish a domed lid of the invention. Exemplary processes that may beused are described in U.S. Pat Nos. 5,873,992 and 5,858,198, which areincorporated herein by reference. Optionally, gas shielding is employedto prevent metal plating on contacts during electroplating to reduceparticulate contamination and increase thickness uniformity.

In a preferred embodiment, the domed lid of the present invention may beproduced by spinning a metal plate, which may be preshaped or not. Themetal is deformed on a rotating chuck by a forming roller into a hollowproduct with a wall thickness. Methods that may be used in the spinningof the domed lid of the present invention include U.S. Pat Nos.5,775,151 and 5,758,532, which are incorporated herein by reference.

As it is critical to minimize contamination within the transfer chamber,the internal side of the domed lid is preferably cleaned followingmanufacturing (e.g., by sanding, finishing, electro-polishing, etc.) or,in the case its desirable to use the lid for both convex and concaveplacement, sanding or finishing both sides of the dome. An exemplaryelectro-polishing process that may be used to finish the domed lid ofthe invention is described in U.S. Pat No. 4,330,381. This processingstep after manufacture of the lid removes contaminating particles thatare undesirable in the sterile environment of the transfer chamber of avacuum processing system and can provide a smooth surface of the domedlid for ease of handling and use. Where only one placement of the lid isenvisioned, the domed lid can be spun so that the finished surface isinternal to the transfer chamber.

As it is critical to minimize contamination with the transfer chamber,the internal side of the domed lid i. preferably cleaned followingmanufacturing (e.g., by sanding, finishing, electro-polishing, etc.) or,in the ca it is desirable to use the lid for both convex and concaveplacement, sanding or finishing both sides of the dome. A exemplaryelectro-polishing process that may be used to finish the domed lid ofthe invention is described in U.S. Pat. No. 4,330,381. This processingstep after manufactur of the lid removes contaminating particles thatare undesirable in the sterile environment of the transfer chamber of avacuum processing system and can provide a smooth surface of the domedlid for ease of handling and use. Where only one placement of the lid isenvisioned, the domed lid can be spun so that the finished surface isinternal to the transfer chamber.

While the present invention has been described with reference to thespecific embodiments thereof, it should be understood by those skilledin the art that various changes may be made and equivalents may besubstituted without departing from the true spirit and scope of theinvention. In addition, many modifications may be made to adapt aparticular situation, material, composition of matter, process, processstep or steps, to the objective, spirit and scope of the presentinvention. All such modifications are intended to be within the scope ofthe claims appended hereto.

That which is claimed is:
 1. A vacuum processing system, comprising: atransfer chamber; a lid mounted on the transfer chamber wherein the lidhas a curved configuration such that an edge of the lid is sealed to anedge of the transfer chamber and the lid is curved such that a center ofthe lid gradually increases its distance both horizontally andvertically from the edge of the transfer chamber; and a transparentwindow element positioned between the edge of the lid and the edge ofthe transfer chamber.
 2. The vacuum processing system of claim 1 whereinthe transfer chamber is circular.
 3. The vacuum processing system ofclaim 1, wherein the transfer chamber is adapted to couple to and beselectively sealed from at least one processing chamber and at least oneload lock chamber and to house at least an end effector of a robotadapted to transport a substrate between the at least one processingchamber and the at least one load lock chamber.
 4. The vacuum processingsystem of claim 1, wherein the lid has a convex configuration such thatthe lid center is vertically closer to an inside area of the transferchamber as compared to an edge of the lid.
 5. The vacuum processingsystem of claim 1, wherein the lid has a concave configuration such thatthe lid center is vertically further from an inside area of the transferchamber as compared to an edge of the lid.
 6. The vacuum processingsystem of claim 1, wherein the lid comprises a plurality of windowspositioned within the curved configuration of the lid.
 7. The vacuumprocessing system of claim 1, wherein the lid is comprised of a metalselected from the group consisting of copper, aluminum, and steel. 8.The vacuum processing system of claim 1, wherein the lid is comprised ofstainless steel.
 9. The vacuum processing system of claim 8, wherein thelid is constructed by spinning.
 10. The vacuum processing system ofclaim 9, wherein the lid is electro-polished following spinning.
 11. Thevacuum processing system of claim 1, wherein the lid further comprises astructural feature for absorbing stress to the lid.
 12. The vacuumprocessing System of claim 11, wherein the structural feature is an “S”transition.
 13. The vacuum processing system of claim 1, the lid furthercomprises one or more diagnostic devices.
 14. The vacuum processingsystem of claim 1, lid further comprises one or more processing.